Substrate for stressed systems and method of making same

ABSTRACT

A stress absorbing microstructure assembly including a support substrate having an accommodation layer that has plurality of motifs engraved or etched in a surface, a buffer layer and a nucleation layer. The stress absorbing microstructure assembly may also include an insulating layer between the buffer layer and the nucleation layer. This assembly can receive thick epitaxial layers thereon with concern of causing cracking of such layers.

FIELD OF INVENTION

The invention relates to a novel substrate having a mechanical stressabsorption system. In particular the invention is directed to a supportsubstrate for the deposition of a nucleation layer thereon.

BACKGROUND OF INVENTION

Attempts have been made to produce epitaxial layers from materials suchas GaN, GaAs, InP, GaAlAs, InGaAs, AlN, AlGaN, and even SiGe. It isknown that relatively thick layers of these materials, for example,layers having a thickness greater than 1 or 2 μm, are required for goodcrystalline qualities. The advantages of an epitaxial layer not beingstressed (or only slightly stressed), and having a low defect density,i.e., having a dislocation density of less than 10⁶/cm² are also known.

Techniques such as MOCVD have been utilized to obtain epitaxial growthof thick layers of GaN, for example, a layer having a thickness greaterthan 12 μm on a substrate for epitaxy. The epitaxial growth of such GaNlayers has been essentially on the bulk substrates of sapphire, SiC, orSi materials. These three substrates are the most frequently used sincethey are the most readily available substrates, although a few testshave been carried out on substrates such as ZnO or LiGaO₂.

Currently, epitaxial GaN layers homogeneously deposited on a substratesurface have a dislocation density in the range 10⁸ and 10¹⁰/cm²regardless of the nucleation surface used. Additionally, the stresses inthick GaN layers obtained by MOCVD (growth temperature 1000–1100° C.)clearly depend on the coefficient of thermal expansion of the epitaxialsubstrate, which determines the stresses of thermoelastic origin thatare imposed on the system.

For example, GaN layers produced on sapphire are in compression, whilethose obtained on SiC are under slight tension, and those on silicon areunder high tension. Tension stresses produce a strong tendency forcracks to form in the epitaxial film, thereby destroying it. The layerssubjected to the compression stresses, however, are also problematic.

These problems are particularly true for epitaxial growth on siliconsubstrates. For silicon epitaxy support, the limit beyond which cracksappear is about 1 μm to 2 μm, which is a limiting factor in producingthick, good quality epitaxial layers.

Growth tests on SOI (silicon on insulator) substrates have shown thatthe use of that type of substrate can reduce the crystal defect densityin the epitaxially grown layer because of the compliant nature of thevery thin film of silicon present on the oxide. However, that system islimited in its capacity to absorb stresses, in particular for thick GaNlayers (like silicon, at best a film thickness of 1 μm to 2 μm).

It appears that the crystal quality improves by growth on substrateshaving motifs. The dislocation densities obtained are of the order of10⁶/cm². Epitaxial lateral overgrowth (ELO) techniques exist, along withtechniques known as pendeoepitaxy (PE), lateral overgrowth from trenches(LOFT), and cantilever epitaxy (CE). All of these techniques are basedon lateral overgrowth and coalescence of the epitaxially grown layer toultimately form a continuous film. The continuous films obtained haveprecise zones with improved crystal quality (the epitaxial lateralovergrowth (ELOG) technique), or have a homogeneous film of crystalquality (LOFT technique). Those solutions have been demonstrated forsapphire, SiC, and Si (111).

Although these solutions improve the crystal quality of the epitaxiallygrown film, they cannot effectively solve the problem of stress in theepitaxially grown films. Thus, a need exists for a substrate or asupport that can absorb high levels of stress during crystal growth, andin particular during thick epitaxial growth of a material. In particularthere is a need for a support that absorb stresses when the coefficientof thermal expansion of the epitaxial growth material is different fromthat of the substrate. The present invention now satisfies that need

SUMMARY OF INVENTION

In one aspect of the invention, a support substrate is provided whichhas a mechanical stress absorbing system that is capable of absorbingstresses such as those produced by heating or cooling of the substrate.The present invention also relates to a microstructure comprising thenovel support substrate, a nucleation or growth layer; and a bufferlayer or intermediate layer. Also provided is a method of forming thesubstrate assembly.

The mechanical stress absorption system of the support substrate iscapable of absorbing thermoelastic stresses, such as those generated atthe surface of a substrate during temperature changes. The mechanicalstress absorbing system comprises an array of stress absorbing elements,which can be obtained by machining the support substrate, e.g. by ionetching. The absorbing element include motifs such as spaced studs,trenches, or saw cuts or any other geometrical motif that has aflexibility or elasticity in a plane that is parallel to the surface ofthe substrate. During times of stress, the absorbing elements compensateor accommodate such stressed due to its flexibility or elasticityproperties.

The microstructure of the invention comprises the support substratehaving stress absorbing elements, a nucleation layer, and a buffer or anintermediate layer. The microstructure may further include an oxidelayer to form an SOI structure.

Advantageously, the buffer layer of the assembly is also capable ofabsorbing or accommodating stresses that arise during epitaxial growthof the nucleation or growth layer on the support substrate. Further, themicrostructure of the present invention is capable of accommodatingepitaxial layers having thicknesses in the order of a few μm, forexample as much as 4 μm, and in particular thick GaN layers.

The nucleation layer may include by way of example and not limitation,monocrystalline material, such as Si, SiC, GaN, sapphire, AIN ordiamond. In one embodiment, the nucleation layer is obtained by transferfrom a transfer-substrate.

The support substrate, for example and not limitation, includes Si, orSiC, and the buffer layer includes amorphous silicon, porous silicon,polysilicon, amorphous silicon dioxide SiO₂, amorphous silicon nitrideSi₃N₄, silicon carbide (SiC), gallium nitride (GaN), sapphire oraluminum nitride (AlN).

In a preferred embodiment, the microstructure comprises nucleation layerformed from silicon, a buffer layer that is either polycrystal orporous, a support substrate formed from silicon, and an electricallyinsulating layer between the nucleation layer and the buffer layer. Forexample and not limitation, the insulating layer may be an oxide, e.g.,silicon oxide, or a boro-phospho-silicate glass layer. Thus, thestructure of the invention is compatible with SOI (silicon on insulator)type structures.

In another embodiment, the intermediate layer is formed between thesupport substrate and the nucleation layer. If the structure is an SOItype structure, the intermediate layer may be formed between thesuperficial silicon layer and the insulating layer, for example siliconoxide.

In a further embodiment, the nucleation layer and the support substrateis formed from silicon, and an oxide or an electrically insulating layeris located between the nucleation layer and the substrate. Thisembodiment is therefore also compatible with an SOI type structure.

The buffer layer or intermediate layer may be formed between thenucleation layer or the oxide layer and the support substrate, saidbuffer layer being porous or polycrystal, for example, for exampleformed from Si, amorphous silicon, porous silicon, polysilicon, SiC,GaN, sapphire or AlN.

The present invention also provides a method of fabricating a stressabsorbing microstructure comprising the steps of implanting atomicspecies on a transfer substrate to define a plane of weakness so that aportion of the substrate can be easily detached from the transfersubstrate. A mechanical stress absorbing system that preferably includesa plurality of motifs are formed in the surface of a support substrate.The transfer substrate having an implanted layer of species is assembledto the support substrate in a face to face orientation. Thereafter, theplane of weakness of the transfer substrate is treated to further weakenthe plane of weakness without generating cracking of the transfersubstrate. A portion of the transfer substrate is detached from thetransfer substrate so that a portion of the transfer substrate remainson the support substrate to form microstructure assembly of theinvention. If desired, the assembled transfer substrate and supportsubstrate can be heated to about 1000° C. to reinforce bonding betweenthe transfer substrate and the support substrate and without causingcracking in the transfer or support substrates.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a support substrate with a deposited buffer layer anda nucleation layer;

FIG. 2 shows a support substrate with a deposited buffer layer, oxidelayer and nucleation layer;

FIG. 3A illustrates a substrate of the invention with a plurality ofmotifs thereon;

FIG. 3B illustrates a substrate of the invention with a plurality ofmotifs;

FIG. 3C illustrates a substrate of the invention with notches;

FIG. 4 illustrates a two dimensional pattern of motifs on a substrate;

FIG. 5A illustrate a transfer substrate and a support substrate withmotifs; and

FIG. 5B illustrates the substrate of 5A with deposited transfersubstrate from 5A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention provides a support substrate having a mechanicalstress absorption system. In one aspect of the present invention, and asshown in FIG. 3A, a support substrate 20 or rigid support, is providedwith this system as an accommodation layer 22. The accommodation layeris elastic or has a certain degree of elasticity at least in a plane xy,parallel to the plane of layer 24, and layer 26. The accommodation layer22 comprises at least one motif, such as notches, and/or trenches, bothof which may be etched into the substrate layer 20. Alternatively, anyother geometric motif that has a stress absorbing effect may be used.Preferably, the at least one motif has an elasticity or flexibility in aplane parallel to the plane of layers 24, 26. As known in the art, theresulting elasticity can be calculated by applying the conventional beamtheory.

In one embodiment, as shown in FIG. 3B, the accommodation layer 23, isformed at the rear face of substrate 20. Thus, potential difficultiesassociated with adhering layer 26 and the substrate 20 is minimized.

Advantageously, the embodiments of the present invention are capable ofabsorbing stresses. Additionally, the two mechanical stressaccommodation systems as shown in FIGS. 3A and 3B can be present in thesame substrate.

In another embodiment, and as shown in FIG. 3C, motifs in the form ofnotches 25 such as “saw-cuts,” are made in the substrate 20.

In accordance with the invention, the motifs as shown in FIGS. 3A, 3B,and 3C are on at least one side of the substrate of the invention.However, it is also within the present invention to have the motifs suchas the notches or trenches illustrated herein on both the front and rearfaces of the substrate.

The etched or hollowed out motifs preferably repeat themselves in atwo-dimensional periodic pattern or in one dimension as shown in FIG. 4.

For example and not limitation the trenches have a depth p equal toabout 10 μm, a width l=1 μm and are spaced apart by an amount of aboute=1 μm. The trenches are hollowed into the substrate 20 to generate amechanical stress absorption system.

Nucleation layer 24 for example and not limitation may be a layer ofmonocrystalline material obtained by transferring a thin layer from afirst substrate, for example using the “SMART-CUT” method or byfracturing the substrate. Alternatively, the nucleation layer includessilicon, silicon carbide, gallium nitride, sapphire, aluminum nitride ordiamond.

Buffer or intermediate layer 26 and the for example, be a polycrystal orporous layer or amorphous layer. For example and not limitation, thebuffer layer includes of Si, SiC, GaN, sapphire or AlN or siliconnitride.

Substrate 20 may be for example comprised of silicon, silicon carbide,sapphire, aluminum nitride or diamond.

In another aspect of the present invention, the structure of FIGS. 3A,3B, or 3C can also be a SOI type structure, wherein layer 26 is an oxidelayer or insulator layer and layer 24 is a layer of silicon. Forexample, with reference to FIG. 2, substrate 16 may be etched so as toform motifs on at least one of the faces parallel to the plane of thelayers 10, 12, 14 to form an elastic accommodation layer as describedabove with reference to FIGS. 3A to 3C. Thereafter the structure maycomprise a buffer layer 14, an oxide layer 12, and a thin semiconductormaterial layer 10.

Support substrate of the present invention that have motifs such ashollowed out trenches or etched notches and the like also havesubstantially reduced surface areas. Thus, the contact surface area isreduced. Therefore, molecular bonding the substrate to deposited layermay be modified to overcome the reduced contact surface areas. Forexample, the distribution of the trenches or of the notches could beoptimized to allow spontaneous bonding. To this end, the geometricparameters of the patterns could be adjusted, e.g. the width and/or theperiodicity of said patterns.

Further, in order to obtain an etched substrate and to be able topreserve a flat bonding surface, it is possible to obturate the surfaceof the substrate in part or completely prior to bonding. Even completeobturation over the entire depth of the trenches or of the etchedpatterns enables an absorption effect of the stresses to be conserved.

In one example, if the surface is formed from silicon, a step forsmoothing the surface of the substrate 20 in a stream of hydrogen can becarried out to close the etching pits in part or completely by migrationof silicon atoms, as illustrated in FIG. 4, in which reference number 28indicates filling of a trench with silicon over a certain depth h.

In a further example, a non-conforming material (for example an oxide)is deposited to obturate the trenches at the surface. The deposit can becarried out by a non-optimized shallow trench isolation (STI) fillingmethod. Such a method is, for example, described in C. P. Chang et al.“A Highly Manufacturable Corner Rounding Solution for 0.18 μm ShallowTrench Insulation”, IEMD 97-661.

Advantageously, the assembled support forms an element that canmechanically absorb stresses by movement and/or deformation of the barsor notches or the walls of the trenches under the effect of thethermoelastic stress.

As mentioned above, a buffer or intermediate layer is interposed betweena nucleation or growth layer and a substrate. The buffer layer canabsorb a quantity of stresses, for example by generating crystallinedefects in said layer or by mechanical displacement of material in saidlayer. FIG. 1 illustrates a nucleation layer 2, buffer layer 4 and asupport substrate 6 of the present invention.

The substrate 6 includes Si or SiC or sapphire (Al₂O₃) or aluminumnitride (AlN). The buffer layer 4 is a polycrystal, porous, or amorphouslayer. It can be formed by CVD techniques and can be formed from silicon(Si), silicon carbide (SiC), gallium nitride (GaN), sapphire or aluminumnitride (AlN), silicon dioxide (SiO₂), or silicon nitride Si₃N₄. Thebuffer layer can be a thin layer of amorphous silicon, polysilicon orporous silicon (obtained by intentional porosification or by porousdeposit).

The nucleation layer 2 is, for example, a layer of monocrystallinematerial, obtained by transferring a thin layer from a first substrate,for example using the fracture method known as “SMART-CUT” (see FIGS. 5Aand 5B relating to this subject, or even the article by A. J.Auberton-Hervé cited below in this description).

Typically, the thickness of the nucleation layer is of the order ofabout 0.1 μm to 2 μm thick, for example 0.5 μm; the thickness of thebuffer layer is of the order of a few tenths of μm, for example about0.1 μm to about 1 μm or 2 μm, and the substrate can be of the order ofseveral hundred μm, or in the range 100 μm to 700 μm, for example about500 μm or 525 μm.

The coefficients of thermal expansion C₁ and C₂ of the nucleation layer2 and of the substrate 6 can be different. For example, SiC has acoefficient of thermal expansion of 4.5×10⁻⁶K⁻¹ Si has a coefficient of2.5×10⁻⁶K⁻¹, alumina (Al₂O₃) has a coefficient of 7×10⁻⁶K⁻¹.

This difference in the coefficients of the layer 2 and of the substrate6 can generate stresses during phases of temperature rise or fall, inparticular once the relative difference |C₁−C₂|/C₁ or |C₁−C₂|/C₂ is atleast 10% or 20% or 30% at ambient temperature, i.e. about 20° C. or 25°C.

Stresses generated during an excursion in temperature are absorbed bythe buffer layer 4. In the case of a polycrystal layer, the stresses areabsorbed therein by defect generation. In the case of a porous layer,the pores allow local displacement of material which mechanically absorbthe tensions or stresses. In the case of an amorphous layer, theprivileged relaxation mode of the stresses occurs by creep of the layerspresent.

Also in accordance with the invention is an SOI type structure in whichthe oxide becomes viscous at a lower temperature, for example aboro-phospho-silicate glass (BPSG). The viscous layer absorbs thetensions and stresses by creep.

The buffer layer as described above may be interposed in an SOIstructure between the oxide or insulating layer and the substrate, asshown in FIG. 2, where 10 designates a thin layer of semiconductivematerial, preferably monocrystalline, e.g. formed from silicon, siliconcarbon SiC, gallium nitride GaN, sapphire, or AIN. Reference number 12designates a layer of SiO₂ oxide, layer 14 represents the buffer layerand reference number 16 represents a substrate formed from asemiconductive material, e.g. thick silicon.

The oxide layer of the SOI structure acts as a stress accommodationlayer because the crystal growth methods are carried out at temperaturesof the order of several hundred degrees (for example: 1000° C.). Atthose temperatures, the oxide becomes viscous and absorbs some of thestresses. The buffer layer 14 will also absorb some of said stresses,but in a different manner as it does not become viscous.

The relative difference in the coefficient of thermal expansion betweenthe nucleation layer 10 and the substrate 16 can therefore, likewise, begreater than 10% or 20% or 30% at ambient temperature (20° C. or 25°C.).

For an SOI structure, the buffer layer 14 can, for example, result froma deposit of amorphous or polycrystal silicon that can box in and absorbstresses and is, for example, in the range 10 nm to 1 μm or 0.1 μm to 2μm thick.

Typically, the thickness of the layer 10, which can be formed bytransfer, is about 10 nm to 300 nm, or is even in the range 0.1 μm to 2μm. The thickness of the layer 12, which can be formed by deposit, is ofthe order of a few hundred nm, for example in the range 100 nm to 700nm, for example 400 nm.

The substrate 10 can be of substantially the same thickness as thesubstrate 6 in FIG. 1.

FIGS. 5A and 5B illustrate a method of preparing the structure of thepresent invention.

In a first step (FIG. 5A), substrate 40 is implanted with ionic oratomic species to define a thin layer 52 of implanted species whichextends substantially parallel to the surface 41 of the substrate 40. Alayer or plane of weakness or fracture is formed, defining in the volumeof the substrate 40 a lower region 45 intended to constitute a thin filmand an upper region 44 constituting the bulk of the substrate 40.Hydrogen is generally implanted, but other species can also beimplanted, including co-implantation of hydrogen and helium.

The substrate 42 is provided with motifs such as engraved patterns, forexample, as described above. Engraving is performed from the surface 43and/or from the surface 47.

The two substrates 40 and 42 are then assembled with face 43 againstface 41 using a wafer bonding technique (assembling wafers using anytechnique that is known in the microelectronics field) or by adhesivecontact (e.g. molecular adhesion) or by bonding. With regard to thesetechniques, reference could be made to the work by Q. Y. Tong and U.Gösele, “Semiconductor Wafer Bonding”, (Science and Technology), WileyInterscience Publications.

A portion 44 of the substrate 40 is then removed by a thermal ormechanical treatment that causes a fracture along the plane of weakness52. An example of that technique is described in the above-mentionedarticle by A. J. Auberton-Hervé et al. The structure obtained is thatshown in FIG. 5B.

In order to reinforce the bonding interface or the join between thesubstrate 42 (or its face 43) and the thin layer 45 (or the contact face41), it may be desirable to raise the temperature to about 1000° C.

During the different temperature rise phases, the structure of themotifs etched in the substrate 42, in particular their flexibility orelasticity, compensates for or absorbs the stresses and the varieddifferences due to differences between the coefficients of the thermalexpansion of the two substrates 40, 42. The relative difference betweensaid coefficients can, as already mentioned above, be at least 10% or atleast 20% or at least 30% at ambient temperature.

The film 45 can also be a nucleation or growth layer such as the layer2, 10, or 24 in FIGS. 1 to 3C (the substrate 42 being similar to thesubstrate 6, 16, 20 in FIGS. 1 to 4). However, unlike those structures,the structure in FIG. 5B does not present a buffer layer.

The film 45 can also be replaced by an assembly of superimposed films.In other words, this aspect of the invention not only concerns amonolayer on substrate system, but any multilayer system that employslayers deposited on a substrate. It is, for example, the association ofthe nucleation layer and the buffer layer in FIGS. 1 to 3C.

The formation of a plane of weakness can be obtained by methods otherthan ion implantation. Thus, it is also to make a layer of poroussilicon, as described in the article by K. Sataguchi et al. “ELTRAN® bySplitting Porous Si layers”, Proceedings of the 9th InternationalSymposium on Silicon-on-Insulator Tech. and Device, 99-3, theElectrochemical Society, Seattle, p.117–121 (1999).

Other techniques also enable the substrates to be thinned withoutimplementing ion implantation and without creating a plane of weakness:such techniques include polishing and etching.

1. A support substrate for a microstructure assembly comprising: asubstrate of a material that is useful in semiconductor applications andthat has front and rear faces; and a mechanical stress absorbing systemassociated with the substrate, wherein the stress absorbing system ispresent at least on the rear face of the substrate and absorbs oraccommodates stresses caused by epitaxial growth of a crystallinematerial on the front face of the substrate.
 2. The support substrate ofclaim 1, wherein the mechanical stress absorbing system comprises anaccommodation layer has an elasticity that is parallel to the surface ofthe support substrate, wherein the elasticity of the accommodation layercompensates for thermoplastic stress applied to the substrate.
 3. Thesupport substrate of claim 1, wherein the accommodation layer is definedby a plurality of motifs formed in a surface of the substrate.
 4. Thesupport substrate of claim 3, wherein the motifs include spaced studs,trenches or saw-cuts.
 5. The support substrate of claim 3, wherein themotifs are ion etched into the substrate surface.
 6. The supportsubstrate of claim 4, wherein the plurality of motifs are spaced apartby a distance of at least 1 μm.
 7. The support substrate of claim 4,wherein the trenches have a depth of about 10 μm and a width of about 1μm.
 8. A stress absorbing microstructure assembly comprising: a supportsubstrate; a buffer layer deposited on the support substrate; atransferred nucleation layer bonded with at least one of the bufferlayer and the support substrate, the nucleation layer being transferredby a layer transfer process from a different substrate; and a mechanicalstress absorbing system associated with the support substrate.
 9. Thestress absorbing microstructure assembly of claim 8, wherein themechanical stress absorbing system comprises an accommodation layer thathas an elasticity that is parallel to the surface of the supportsubstrate, wherein the elasticity of the accommodation layer compensatesfor thermoplastic stress applied to the substrate.
 10. The stressabsorbing microstructure assembly of claim 8, wherein the accommodationlayer is defined by a plurality of motifs formed in a surface of thesubstrate.
 11. The stress absorbing microstructure assembly of claim 10,wherein the plurality of motifs is provided by etching at least onesurface of the support substrate.
 12. The stress absorbingmicrostructure assembly of claim 10, wherein the plurality of motifsformed in the support substrate includes spaced notches, trenches, orsaw cuts.
 13. The stress absorbing microstructure assembly of claim 12,wherein the trenches have a depth of about 10 μm, a width of about 1 μmand are spaced by about 1 μm.
 14. The stress absorbing microstructureassembly of claim 10, wherein the plurality of motifs are distributed onthe surface of the support substrate to optimize spontaneous bondingbetween the substrate surface and either the buffer layer or thenucleation layer.
 15. A stress absorbing microstructure assembly ofcomprising: a support substrate; a buffer layer deposited on the supportsubstrate; a nucleation layer deposited on at least one of the bufferlayer or the support substrate; and a mechanical stress absorbing systemassociated with the substrate, which comprises an accommodation layerthat has an elasticity that is parallel to the surface of the supportsubstrate, wherein the elasticity of the accommodation layer compensatesfor thermoplastic stress applied to the substrate, wherein theaccommodation layer is defined by a plurality of motifs formed in asurface of the substrate and at least one of the motifs on the surfaceof the substrate is obturated with species to provide a smooth bondingsurface.
 16. The stress absorbing micro structure assembly of claim 8,wherein the nucleation layer comprises a material selected from thegroup consisting silicon, silicon carbide, gallium nitride, sapphire,aluminum nitride, and diamond.
 17. The stress absorbing microstructureassembly of claim 8, wherein the support substrate comprises a materialselected from the group consisting of silicon, silicon carbide,sapphire, aluminum nitride, and diamond.
 18. The stress absorbingmicrostructure assembly of claim 8, wherein the buffer layer comprises amaterial selected from the group consisting of silicon, amorphoussilicon, porous silicon, polysilicon, silicon carbide, gallium nitride,sapphire, aluminum nitride, and silicon nitride.
 19. The stressabsorbing micro structure assembly of claim 8, further comprising aninsulating layer.
 20. The stress absorbing microstructure assembly ofclaim 19, wherein the insulating layer is selected from the groupconsisting of thermal or deposited oxide of silicon, andboro-phospho-silicate glass.
 21. The stress absorbing microstructureassembly of claim 8, wherein the nucleation layer has a thicknessbetween about 0.1 μm to 2 μm.
 22. The stress absorbing microstructureassembly of claim 8, wherein the buffer layer has a thickness of about0.01 μm to 2 μm.
 23. The stress absorbing microstructure assembly ofclaim 8, wherein the nucleation layer has a coefficient of thermalexpansion that is different from that of the support substrate.
 24. Thestress absorbing microstructure assembly of claim 15, wherein thesupport substrate has front and rear sides and the stress absorbingsystem is present at least on one side of the support substrate.
 25. Thestress absorbing microstructure assembly of claim 8, wherein the supportsubstrate has front and rear sides and the stress absorbing system ispresent at least on one side of the support substrate.
 26. The stressabsorbing microstructure assembly of claim 25, wherein the stressabsorbing system is present on the rear side of the support substrateand includes a plurality of spaced motifs that are in contact withsupport substrate.
 27. The stress absorbing microstructure assembly ofclaim 25, wherein the stress absorbing system is present on the rearside of the support substrate and includes a plurality of spaced motifsthat do not contact the support substrate.